Beo/Aluminum Nitride Aln Ceramic Dpc Dbc Amb Thick Film Substrate with Copper

• Customization: Available
• Application: Structure Ceramic
• Function: Corrosion Preventive
• Model NO.: HBF-E003
• Material: Aluminum Nitride/Beo
• Process: Special Ceramic Plate
• Name: Aluminum Nitride Plate
• Custom: Yes
• Color: Grey
• Certification: ISO9001
• Base Material: Aln, Beo, Alumina, Silicon Nitride, Quartz etc
• Plated Layer: Nickel/Copper/Gold
• Plating Thickness: 2-9um
• Transport Package: Export Carton
• Specification: customized
• Trademark: HIGHBORN
• Origin: Jiangsu, China
• Production Capacity: 10000PCS Per Month
• Package Size: 25.00cm * 25.00cm * 20.00cm
• Package Gross Weight: 0.500kg

Product Description

Product Description

AlN DBC AMB DPC Ceramic Substrate

customized AlN metallized substrate solutions, including DBC direct bonded copper, AMB active metal brazing, DPC thin film plating three mainstream processes, with post nickel-gold surface finishing. All products adopt high-purity fully dense sintered AlN ceramic base, stable batch thermal performance, full quantitative testing before shipment, fully meet automotive, aerospace, semiconductor industry high reliability standards.

 AMB AlN ceramic substrate with gold plating

Thermal Conductivity Grade: Standard 170–180 W/m·K, high thermal 190–210 W/m·K, ultra-high thermal 220–230 W/m·K, 7–10x higher than alumina substrate, chip junction temperature reduced by 15–22℃ under full load

Thermal Expansion Coefficient (CTE): 4.4–4.8×10-6/K, highly matched with silicon, SiC, GaN chips, thermal cycle failure rate reduced by 93%
Electrical Insulation: Dielectric strength ≥15 kV/mm, volume resistivity ≥10 14 Ω·cm, low dielectric loss, stable insulation under 1200V high frequency high voltage

Mechanical Property: AlN flexural strength ≥330 MPa, copper-ceramic bonding force ≥20 N/cm², withstand 50,000+ thermal cycling tests without delamination

DBC Direct Bonded Copper: Low cost, copper thickness 0.1–0.5mm, suitable medium power modules, thermal cycle 30,000 cycles
AMB Active Metal Brazing: Ultra-high bonding strength, withstand 50,000 thermal cycles, fit automotive EV, aerospace high reliability scenarios
DPC Thin Film Plating: Ultra-fine 50μm micro-circuit, thin copper layer, high-frequency RF, laser chip packaging preferred

ALN substrate

Gold layer fully isolate copper from air, 100% anti-oxidation, no surface oxidation after 1000h high temperature humidity test
Low resistivity gold surface, reduce signal loss by 65% for high-frequency RF devices
Compatible with Au wire bonding, silver sintering, multiple chip packaging processes, reduce virtual solder rate by 88%

Q1: What's the difference between DBC, AMB and DPC AlN gold plated substrates?
A:
DBC: Direct copper high-temperature bonding, cost-effective, copper thickness 0.1–0.5mm, suitable general power modules, 30,000 thermal cycles
AMB: Active metal vacuum brazing, maximum bonding strength, 50,000 thermal cycles, automotive/aerospace high reliability projects
DPC: Thin film sputtering + electroplating, 50μm ultra-fine circuit, thin copper layer, for RF, laser, mini chip packaging 
All three processes support nickel-gold surface plating customization.

Technical Specifications

(The above data is only for your reference)

Property Content	Unit	Property Index
Density	g/cm3	≥3.30g/cm3
Water absorption	%	0
Thermal conductivity	(20 ℃,W/m.k)	≥170
Linear expansion coefficient	(RT-400℃,10-6)	4.4
Flexural strength	Mpa	≥330
Bulk resistance	Ω.cm	≥1014
Dielectric constant	1MHz	9.0
Dissipation factor	1MHz	3 x 10-4
Dielectric strength	KV/mm	≥15
Surface roughness	Ra(μm)	0.3~0.5
Camber	(~25.4(length))	0.03~0.05
Appearance		Dense

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FAQ

Q1: Can you provide exclusive customized solutions for special project demands? 
A1: Yes. In addition to conventional OEM and ODM customization, we can develop exclusive product structures, adjust technical parameters and optimize solutions according to special project standards, regional industry specifications and personalized buyer requirements, providing one-to-one customized technical support.
 
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Q3: How do you ensure on-time delivery for bulk orders? 
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Q4: Why is your factory price more stable than trading companies? 
A4: As a direct manufacturer, we control all links from raw material procurement, production processing to finished product output. There is no intermediate markup, and we can adjust costs according to long-term cooperative orders, maintaining stable and transparent pricing for long-term strategic partners.
 
Q5: What customized service items can you support besides product structure? 
A5: Besides structural size and precision tolerance customization of industrial ceramic and quartz products, we support personalized services including custom deep processing, surface treatment, laser marking, custom packaging and technical document customization to meet different industrial and brand standards.